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回到2008年,Intel®推出了其Atom®系列处理器的第一代——Intel® Atom®处理器Z500系列——一种全新的、低功耗的嵌入式CPU概念,以此提供最佳运行性能。这一创新技术为全新市场铺展了道路,促使公司急切地追求开发能够利用这些处理器的能力的平台。SECO赛柯也开始着手开发,意识到这是研发新产品的机会,是以前从未做过的事情。于是,为计算机模块(COM)建立新标准的想法应运而生。

SECO launches COM Express Type 6 module based on 13th Gen Intel Core Processors

SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches CALLISTO, a COM Express® Rel. 3.1 Type 6 module based on new 13th Gen Intel Core processors. SECO was granted early access to design information and processor silicon via its participation in the Intel Early Access Program.

SECO launches SMARC® module based on Intel Atom processors x7000E Series, Intel Core i3 processor, Intel Processors N Series

SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches FINLAY, a SMARC® Rel. 2.1 compliant computer-on-module (COM) based on Intel Atom processors x7000E Series, Intel Core i3 processors, Intel Processors N Series (Codename: Alder Lake-N). This happens simultaneously with Intel’s release of this latest generation processor platform, to which SECO was granted early design information and processor silicon to accelerate the development of its solution.

SECO launches PHOENIX and PYXIS, two new fanless computer solutions

SECO, Gold Member of the Intel® Partner Alliance, expands its lineup of cutting-edge computing solutions based on Intel® high-performance microprocessor platforms. Today, the company is launching two new fanless embedded computers for commercial and industrial environments, one based on 11th generation Intel® Core™ and Intel® Celeron® processors (formerly Tiger Lake UP3), the other based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® N and J Series processors (formerly Elkhart Lake).

Contactless payment with SECO's KarL4 now available with MasterCard and Visa

SECO has expanded the functionality of its KarL4 payment system. This means that contactless payment at terminals and machines enabled with KarL4 will soon be possible also with MasterCard and Visa in European countries outside Germany. Approval for the use of these credit cards with KarL4 is planned for the end of June.

SECO to launch two off-the-shelf computing solutions based on 11th Gen Intel® Core™ processors

SECO, a Gold Member of the Intel® Partner Alliance, continues its collaboration with Intel® in designing and developing edge solutions that leverage the most innovative and high-performance Intel® platforms. Today, SECO introduces to its product portfolio two new standard form factor solutions – a COM Express® Type 6 Compact Module and a 3.5” single board computer – both based on the 11th Gen Intel® Core™ processors (formerly Tiger Lake UP3).

Experience the future of Vending enabled by Oniro OS at SECO booth at embedded world

Oniro is a distributed open-source operating designed with the goal of achieving a more intuitive and collaborative way for intra device collaboration, offering greater levels of flexibility and application portability across the broad spectrum of consumer and IoT devices. Visitors at the embedded world Exhibition & Conference will have the opportunity to explore Oniro OS capabilities through a demo at the SECO booth.

Deep dive: Clea-based demos showcased at embedded world

At this year’s edition of embedded world visitors will learn how to add intelligence to edge devices with SECO’s Clea software platform. Through application demos, visitors will discover the ease and power of data orchestration, data analytics, and artificial intelligence.

SECO presents its expanded Human Machine Interface portfolio at embedded world 2022

Through the acquisition of the Garz & Fricke Group in 2021, SECO customers benefit from a unique and complete human machine interface (HMI) product portfolio. At this year's embedded world trade fair, SECO will present its modular product portfolio, which combines a wide variety of processors with sophisticated installation options.

Discovering more about SECO product portfolio showcased at embedded world 2022

embedded world Exhibition and Conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre. SECO will welcome visitors at booth 1-310/1-320 to show its extensive portfolio of embedded computing, human-machine interface (HMI), communication gateway, payment system, custom packaged product, and IoT software solutions.

SECO joins Arm’S Project Cassini initiative for a new era of Arm-based Edge

Arezzo, 15 December 2021 - SECO, a leading technological innovator and provider of Internet of Things solutions, proudly announces that it has joined Project Cassini, an initiative led by Arm, achieving its first Arm® SystemReady IR Certification for SECO’s SBC-C61 single board computer based on the NXP i.MX 8M Mini microprocessor.

Embedded world 2021: introducing Clea

Discovering more about the suite solution that integrates Artificial Intelligence, Internet of Things, Cloud Computing and Big Data Analysis with customer service

SECO, in 2019 revenues grow by over 20%

Arezzo – May 11th 2020 – The Board of Directors of SECO SPA, a high-tech manufacturer of computer miniaturization and “ready-to-use” IoT integrated systems, with shareholder FII Tech Growth fund backed by Cassa Depositi e Prestiti, presented today its 2019 financial results.

FAQ on SECO’s actions for COVID-19

We are closely monitoring the situation to provide unfiltered and up-to-date information about our facilities and infrastructure. With this post we want to respond to the Frequently Asked Questions about our business

SECO integrates InHand Electronics

SECOs pleased to announce that it has completed the acquisition of 100% of InHand, a Maryland-based leading provider of low-power rugged embedded systems and software.

SECO cuts the edge with the COM-HPC™

SECO is developing state-of-the-art solutions suitable for the most advanced applications. Let’s talk about the newest standard from PICMG®COM-HPC™

SECO NXP-based product portfolio at Embedded World 2020

From February 25th to 27th 2020, embedded world exhibition & conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre, Germany. At SECO's booth, among the variety of products displayed, there will be a strong focus on NXP-based solutions.

Embedded World 2020: SECO presents its AMD-based solutions

In this edition of embedded world exhibition & conference, SECO will be showcasing many innovative solutions including products based on the latest AMD Ryzen™ Embedded Processors, i.e. the COMe-B75-CT6 and the COMe-C89-CT6. 

SECO's 40th anniversary

We’re in a garage in the 1970s and two guys are in the process of inventing the future. 


SECO is pleased to announce that today it has signed an agreement to acquire InHand, a Maryland-based leading provider of low-power embedded systems and software to original equipment manufacturers of handheld, portable, battery operated, Internet of Things (IoT), and wireless devices.

FII Tech Growth invests in SECO

Milan, 20th April 2018 – FII Tech Growth, a fund managed by Fondo Italiano d’Investimento SGR, announces today its second investment in SECO SpA, one of the European leaders in the embedded electronics market. SECO, headquartered in Arezzo, Tuscany, with subsidiaries in the U.S.A., Germany and Taiwan, was founded in 1979 by entrepreneurs Daniele Conti and Luciano Secciani.