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在我们的日常生活中，触摸屏的普及程度超乎想象，无论是手机、平板电脑，还是车载系统、智能门锁，都离不开它的身影。那么，工业触摸屏又与日常消费电子屏有什么区别呢？今天就跟着SECO赛柯一起揭开工控触摸屏的神秘面纱吧～

在工业智能化的今天，食品包装产业也面临着产品更新换代的问题。SECO赛柯为TEMA公司（以下简称客户）定制了基于x86的工业小型单板计算机，为客户降低了成本，提高了工作效率。快跟随小编进一步了解一下吧！

回顾过去的几年，技术在我们行业中更新迭代的速度令人惊叹。虽然只有15年的时间，但自从SECO赛柯在嵌入式计算机历史上达到了一个里程碑以来，似乎已经过了很久了。

回到2008年，Intel®推出了其Atom®系列处理器的第一代——Intel® Atom®处理器Z500系列——一种全新的、低功耗的嵌入式CPU概念，以此提供最佳运行性能。这一创新技术为全新市场铺展了道路，促使公司急切地追求开发能够利用这些处理器的能力的平台。SECO赛柯也开始着手开发，意识到这是研发新产品的机会，是以前从未做过的事情。于是，为计算机模块（COM）建立新标准的想法应运而生。

为了顺应时代的变化，石油与天然气运输服务行业需要不断更新设备、技术创新，以防发展滞后，SECO赛柯为一家天然气运输和储存领域的运营商提供了可配置化和模块化的新一代UM和RTU，提高了其安全性。快跟随小编进一步了解一下吧！

SECO and one-stop provider of hardware and software solutions for the embedded systems market Gopalam Embedded Systems Pte Ltd (GES), announce today their agreement to cooperate in the Asia-Pacific (APAC) region.

SECO和Exein高兴地宣布他们将共同参加于2023年6月14日至16日在中国上海国家会展中心（SWEECC）H3展馆举办的2023上海国际嵌入式展。

SECO joins Axelera AI’s ecosystem as sole European developer of innovative AI accelerators based on Metis™ AI Platform.

SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches CALLISTO, a COM Express® Rel. 3.1 Type 6 module based on new 13th Gen Intel Core processors. SECO was granted early access to design information and processor silicon via its participation in the Intel Early Access Program.

SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches FINLAY, a SMARC® Rel. 2.1 compliant computer-on-module (COM) based on Intel Atom processors x7000E Series, Intel Core i3 processors, Intel Processors N Series (Codename: Alder Lake-N). This happens simultaneously with Intel’s release of this latest generation processor platform, to which SECO was granted early design information and processor silicon to accelerate the development of its solution.

PRE-CLOSING Q3 2022 RESULTS

SECO to showcase novel CLEA AI EV Charging Station at ITS World Congress in Los Angeles

SECO H1 2022 results

SECO, Gold Member of the Intel® Partner Alliance, expands its lineup of cutting-edge computing solutions based on Intel® high-performance microprocessor platforms. Today, the company is launching two new fanless embedded computers for commercial and industrial environments, one based on 11th generation Intel® Core™ and Intel® Celeron® processors (formerly Tiger Lake UP3), the other based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® N and J Series processors (formerly Elkhart Lake).

SECO has expanded the functionality of its KarL4 payment system. This means that contactless payment at terminals and machines enabled with KarL4 will soon be possible also with MasterCard and Visa in European countries outside Germany. Approval for the use of these credit cards with KarL4 is planned for the end of June.

Computer-on-Modules with Arm architecture now available with Windows 10 IoT Enterprise

After the recent announcement of an industrial partnership aimed at integrating Exein’s cybersecurity software solutions into SECO products, the two companies are set to present their collaboration to embedded world’s visitors.

SECO, a Gold Member of the Intel® Partner Alliance, continues its collaboration with Intel® in designing and developing edge solutions that leverage the most innovative and high-performance Intel® platforms. Today, SECO introduces to its product portfolio two new standard form factor solutions – a COM Express® Type 6 Compact Module and a 3.5” single board computer – both based on the 11th Gen Intel® Core™ processors (formerly Tiger Lake UP3).

Oniro is a distributed open-source operating designed with the goal of achieving a more intuitive and collaborative way for intra device collaboration, offering greater levels of flexibility and application portability across the broad spectrum of consumer and IoT devices. Visitors at the embedded world Exhibition & Conference will have the opportunity to explore Oniro OS capabilities through a demo at the SECO booth.

At this year’s edition of embedded world visitors will learn how to add intelligence to edge devices with SECO’s Clea software platform. Through application demos, visitors will discover the ease and power of data orchestration, data analytics, and artificial intelligence.

SECO enhances its family of fanless embedded computers with CHAMALEON, a boxed IP65 solution providing an excellent balance between computing and graphics performance, together with low power consumption.

SECO adds to its family of Smart Edge boxed solutions DORADO, a fanless, IP20 box PC based on the Rockchip RK3399 applications processor specifically designed for high-end industrial applications.

Through the acquisition of the Garz & Fricke Group in 2021, SECO customers benefit from a unique and complete human machine interface (HMI) product portfolio. At this year's embedded world trade fair, SECO will present its modular product portfolio, which combines a wide variety of processors with sophisticated installation options.

embedded world Exhibition and Conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre. SECO will welcome visitors at booth 1-310/1-320 to show its extensive portfolio of embedded computing, human-machine interface (HMI), communication gateway, payment system, custom packaged product, and IoT software solutions.

The leading international tradeshow for embedded system technology returns in-person; SECO prepares to meet with customers and partners

SECO, a global leader of innovative embedded computing solutions, today announces a new Qseven® Cross Platform Starter Kit that includes the basic components necessary to start developing applications using any Qseven® compliant computer on module (COM).

SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, introduces JULIET, a COM Express® Type 7 module based on Intel® Xeon® D-1700 processors (formerly Ice Lake-D). This announcement is simultaneous with Intel®’s release of this latest generation processor platform, for which SECO is an Intel® Early Access Program partner.

SECO, a global leader of technological innovation for Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today announces a new embedded computing solution based on the AMD RyzenTM Embedded V2000 Series Processors: the COM Express® OPHELIA.

Today SECO is pleased to unveil two new computing solutions based on the Intel® Atom™ X6000E Series, Intel® Pentium® and Celeron® N and J Series SoCs (formerly Elkhart Lake) family of processors: the ICARUS single board computer (SBC) and the Qseven® ATLAS system on module (SOM).

SECO enhances its family of Smart Edge box PCs with PICTOR, a fanless embedded computer providing an excellent balance between computing and graphics performance, together with low power consumption.

SECO, center of excellence in the field of technological innovation for IoT and AI solutions, announces today a new boxed solution based on the NXP i.MX 8M family of Applications Processors: the SYS-C20-IPC.

SECO, center of excellence in the field of technological innovation for IoT and AI solutions, announces today a new box PC specifically developed for Edge Computing: the SYS-C43-IPC.

A bridge between the world of frontier research and that of companies, to enable a digital transformation process based on sustainability.

Arezzo, 15 December 2021 - SECO, a leading technological innovator and provider of Internet of Things solutions, proudly announces that it has joined Project Cassini, an initiative led by Arm, achieving its first Arm® SystemReady IR Certification for SECO’s SBC-C61 single board computer based on the NXP i.MX 8M Mini microprocessor.

ROCKVILLE, MD – October 26, 2021 – SECO USA, Inc., a leading provider of rugged embedded electronic devices and software for mission-critical applications, proudly announces the successful demonstration of a new deck control device (DCD) to be used for controlling the MQ-25 (TM) Stingray (TM) unmanned aerial refueler on U.S. Navy aircraft carriers.

• All new machines by Rhea to be connected to CLEA, the IoT-AI software platform powered by SECO
• Roll-out to start in 2022
• Up to speed, ca. 40,000 new devices per year connected to CLEA

SECO is pleased to announce that it has entered into a binding agreement to acquire the entire share capital of Garz & Fricke Holding GmbH

October 04, 2021 - UDOO KEY has hit the Kickstarter goal of $10,000 in 90 minutes.

Arezzo – September 24, 2021 – Today, SECO introduces six new members of its FLEXY VISION family, a series of high-resolution and cost-efficient Panel PCs, also known as Human-Machine Interfaces (HMIs), with various characteristics, dimensions, and operating systems.

Closing of the acquisition of ORO Networks under the newco SECO Mind US.

Multi-year partnership involving the use of the IoT-AI platform Clea

SECO has signed an agreement for the acquisition of Oro Networks, a US company based in the Silicon Valley. A strategic transaction creating value for SECO’s shareholders and giving rise to SECO Mind US. 

Arezzo, 12 April 2021 – SECO S.p.A. (“SECO” or the “Company”) announces its intention to proceed with the listing of its ordinary shares (the “Shares”) on the Mercato Telematico Azionario, organised and managed by Borsa Italiana S.p.A. (the “Listing”), and, should the specific requirements be met, on the STAR segment.

Long-term agreement between Celli and SECO to develop integrated hardware and software solutions for the innovation of customer experience and implementation of predictive maintenance and Artificial Intelligence functionalities

IoT is now customized for SMEs thanks to the Clea application by SECO Mind on the Azure Cloud platform
 

GROUP REVENUES GROW 16.4% WITH INCREASED OPERATIONAL PROFITABILITY

Discovering more about the suite solution that integrates Artificial Intelligence, Internet of Things, Cloud Computing and Big Data Analysis with customer service

The company prepares to virtually showcase its products and services

Marco Parisi appointed as the company’s Investor Relations Manager

SECO Mind presents Clea: the suite solution that integrates Artificial Intelligence, Internet of Things, Cloud Computing and Big Data Analysis with customer service

The number of distributors in the EMEA region keeps growing 

The Italian company acquires Hopenly and completes the evolution of its business model with high value-added services.

SECO enriches its product portfolio based on the NXP i.MX 8 Series of Processors with the SM-D18, a SMARC Rel. 2.1 compliant module with NXP i.MX 8M Plus Application Processors.

The innovative non-invasive pulmonary ventilator born from the partnership of SECO and IBD starts its distribution in Europe

SECO and SDA Bocconi: together to build a bridge between the industrial world, applied research and startups, in the name of Digital Innovation.

Today SECO is pleased to unveil its latest product: the SM-C93, a SMARC® Rel 2.1.1 compliant module with the Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors.

SECO, always at the forefront of the latest technologies, has developed its first COM-HPC® / Client module Size A (95 x 120 mm), with the 11th Generation Intel Core processors: the CHPC-C77-CSA.

REVENUES AS AT JUNE 30, 2020 GREW BY 20% WITH A STRONG INCREASE IN THE GROUP’S PROFITABILITY

The Italian company accelerates its competence and Software as a Service development strategy in the Artificial Intelligence and Internet of Things domains.

On the new website Biorespira.care you can find all about the non-invasive Pulmonary Ventilator developed by SECO in partnership with the innovative Italian company IBD, operating in the biomedical sector.

SECO has just released UDOO BOLT GEAR, the ultimate Mini PC Kit based on AMD Ryzen™ Embedded V1000 Processor. 
 

Arezzo – May 11th 2020 – The Board of Directors of SECO SPA, a high-tech manufacturer of computer miniaturization and “ready-to-use” IoT integrated systems, with shareholder FII Tech Growth fund backed by Cassa Depositi e Prestiti, presented today its 2019 financial results.

SECO is releasing UDOO BOLT GEAR, the ultimate Mini PC Kit by UDOO based on AMD Ryzen™ Embedded V1000 Processor. 

SECO and IBD announce a partnership for the realization of “Respira” non-invasive pulmonary ventilators 

We are closely monitoring the situation to provide unfiltered and up-to-date information about our facilities and infrastructure. With this post we want to respond to the Frequently Asked Questions about our business

SECOs pleased to announce that it has completed the acquisition of 100% of InHand, a Maryland-based leading provider of low-power rugged embedded systems and software.

SECO is developing state-of-the-art solutions suitable for the most advanced applications. Let’s talk about the newest standard from PICMG®: COM-HPC™. 

Among the Arm-based products from SECO’s portfolio on display at embedded world, there will also be the SM-B71, a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC.

2020 edition of embedded world in Germany will provide the opportunity to proudly launch SECO’s partnership with Rockchip, presenting its first off-the-shelf product built on the Rockchip RK3399 processor and developed in 3.5” form factor: the SBC-C31.

At embedded world Exhibition & Conference SECO’s booth, among the many products of its portfolio, will showcase the company’s range of the most up-to-date Intel®-based solutions.

From February 25th to 27th 2020 in Nuremberg, during embedded world Exhibition & Conference, SECO will showcase its latest solutions to the tens of thousands of expected visitors at its booth. Here, SECO will be proud to announce the expansion of its Qseven® standard products portfolio.

From February 25th to 27th 2020, embedded world exhibition & conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre, Germany. At SECO's booth, among the variety of products displayed, there will be a strong focus on NXP-based solutions.

At the embedded world Exhibition & Conference, SECO will be exhibiting its first COM Express™ Type 7 product: the COMe-C42-BT7, a COM Express™ Rel. 3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Processor.

In this edition of embedded world exhibition & conference, SECO will be showcasing many innovative solutions including products based on the latest AMD Ryzen™ Embedded Processors, i.e. the COMe-B75-CT6 and the COMe-C89-CT6. 

At the embedded world Exhibition & Conference, in addition to its vast array of products and services in exposition, SECO is also going to present SENSE-D01  i.e., SECO’s newest microcontroller for industrial applications.

At the embedded world Exhibition & Conference, in addition to its wide range of products and services in exposition, SECO is also going to present EDGEHOG, i.e., SECO’s IIoT-as-a-service platform.

After having obtained the necessary authorization from the Chinese government, SECO acquired the majority shares of Fannal Electronics Co. Ltd.

We’re in a garage in the 1970s and two guys are in the process of inventing the future. 

SECO is pleased to announce that today it has signed an agreement to acquire InHand, a Maryland-based leading provider of low-power embedded systems and software to original equipment manufacturers of handheld, portable, battery operated, Internet of Things (IoT), and wireless devices.

SECO acquires 70% of AiDiLab 

Milan, 20th April 2018 – FII Tech Growth, a fund managed by Fondo Italiano d’Investimento SGR, announces today its second investment in SECO SpA, one of the European leaders in the embedded electronics market. SECO, headquartered in Arezzo, Tuscany, with subsidiaries in the U.S.A., Germany and Taiwan, was founded in 1979 by entrepreneurs Daniele Conti and Luciano Secciani.