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面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。

282 Products

iP5-Base by Keith & Koep

Carrier Board for Trizeps SODIMM SOMs

  • Supports a wide range of interfaces, such as Ethernet, USB 2.0, CAN, RS485
  • HDMI, LVDS or Dual LVDS, RGB interfaces enable easy integration of various touch displays
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[Picture] CQ7-D03_front main

CQ7-D03

Carrier Board for Qseven® and μQseven® Rev 2.1 Modules in embedded NUCTM Form factor

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UDOO BOLT

基于 AMD 锐龙嵌入式 V1000B 系列应用处理器的单板计算机

  • 1x GbE; 2x USB3.0; 2x USB3.1 Gen2; Slot M.2 Socket 1 Key E 2230 for optional Wi-Fi/BT combo
  • AMD Radeon™ VEGA with up to 8 Compute Units GPU
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UDOO BOLT GEAR

基于 AMD 锐龙嵌入式 V1605B 应用处理器的盒式解决方案

  • 1x GbE; 2x USB3.0; 2x USB3.1 Gen2; Slot M.2 Socket 1 Key E 2230 for optional WiFi/BT combo
  • AMD Radeon™ VEGA 8 with 8 Compute Units GPU
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UDOO x86 II

基于英特尔® 赛扬®和奔腾®应用处理器的单板计算机

  • 1x GbE; 3x USB3.0; Slot M.2 Socket 1 Key E 2230 for optional WiFi/BT combo
  • Integrated Graphics, three independent display support
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[Picture] DORADO_Main

Titan 220 RK3399

基于 Rockchip RK3399 应用处理器的 IP20 无风扇嵌入式电脑

  • 1x GbE; 2x USB3.0; 3x USB2.0; 2x RS-232; on-board Wi-Fi+BT5.0; on-board LTE Cat4 modem
  • 4-Core Mali-T860MP4 GPU
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[Picture] CHAMALEON_main image

Titan 250 APL IP65

搭载英特尔®凌动™ x5（原名 Apollo Lake）应用处理器的IP65 无风扇嵌入式电脑

  • up to 4x GbE; WWAN and WLAN M.2 module slots
  • Integrated Intel® HD Graphics 500 series controller
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[Picture] PRISMA_1000x1000

SBC-3.5-TGL-UP3

3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (formerly Tiger Lake UP3) Processors

  • 2x SuperSpeed USB 10Gbps; 2x SuperSpeed USB 20Gbps; 2x USB 2.0; 4x PCIe Gen3; 2x 2.5GbE
  • Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
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SOM-COMe-CT6-TGL-U

搭载第11代英特尔®酷睿™（原名 Tiger Lake UP3）处理器的 COM Express®Rel. 3.0 紧凑型 6 型模块

  • 1x GbE; 4x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x4 Gen4
  • Integrated Intel® Iris® Xe Graphics, up to 96 Execution Units
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UDOO KEY

搭载 ESP32-WROVER-E 模块和 RP2040 微控制器的开发板

  • Programmable expansion connectors
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UDOO VISION

搭载英特尔®凌动® X 系列、英特尔®赛扬® N 系列、英特尔®奔腾® N 系列（原名 Apollo Lake）处理器的 Pico-ITX 单板计算机

  • 1x GbE; 1x USB 3.0; 1x USB 2.0; M.2 Socket 1 Key E 2230 slot for Wi-Fi+BTLE modules
  • Integrated Graphics, three independent display support
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[Picture] PHOENIX_1000x1000 con ombra

Titan 300 TGL-UP3

搭载第11代英特尔®酷睿™和英特尔®赛扬® SoC （原名 Tiger Lake UP3）的无风扇嵌入式计算机

  • 2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
  • Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
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[Picture] PYXIS_1000x1000 con ombra

Titan 290 EHL

搭载英特尔®凌动® X6000E 系列、英特尔®奔腾®和赛扬® N 和 J 系列（原名 Elkhart Lake）SoC的无风扇嵌入式计算机

  • 2x GbE, Optional M.2 WWAN and WLAN modules
  • Integrated Intel® Gen11 UHD Graphics controller, up to 32 Execution Units
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[Picture] CALLISTO main image

SOM-COMe-BT6-RPL-P

COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)

  • 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4.
  • embedded Intel® Iris® Xe graphics with up to 96 execution units
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[Picture] FINLAY_main front

SOM-SMARC-ADL-N

SMARC® Rel. 2.1 compliant module with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N)

  • 2 x NBase-T (2.5GbE supported); 2x USB 3.2 Gen 2; 6x USB 2.0; 4x PCI-e Gen3 lanes with optional SERDES
  • Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution
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