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面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。

279 Products
[Picture] FINLAY_main front

FINLAY

SMARC® Rel. 2.1 compliant module with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N)

  • 2 x NBase-T (2.5GbE supported); 2x USB 3.2 Gen 2; 6x USB 2.0; 4x PCI-e Gen3 lanes with optional SERDES
  • Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution
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MIRA

搭载恩智浦 i.MX 8M 应用处理器的 Qseven®Rel. 2.1 模块

  • 1x USB 3.0; 4x USB2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os
  • Integrated GPU, supports 2 independent displays
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CCOMe-E10

Carrier Board for COM-Express™ Rel. 3.1 Type 6 Modules for Development

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[Picture] MAURY_front main

MAURY

SMARC® Rel. 2.1.1 module with NXP i.MX 9 Applications Processors

  • Display up to FHD
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SAYLOR

3.5” SBC with Rockchip RK3568 SoC

  • 2x GbE; opt Wi-Fi; 2x RS-232 or RS-485, 2x CAN; M.2 slot for modem and on-board microSIM slot
  • Mali-G52 1-Core-2EE
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[Picture] SOM-COM-HPC-A-RPL_front main

SOM-COM-HPC-A-RPL

采用第13代英特尔®酷睿™处理器（代号：猛禽湖 - H/P/U 系列）的 COM-HPC® 客户端模块尺寸 A。

  • 2x 2.5GbE; 4x USB4.0 / USB 3.2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2
  • Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
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Modular Vision 7 MX93

基于 NXP i.MX93 的入门级七英寸人机界面 (HMI)

  • Gb Ethernet, RS485, CAN, RS232, USB, Digital I/O
  • 2D graphics
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[Picture] Modular Vision 15.6 EHL_1

Modular Vision 15.6 EHL

基于英特尔® Atom®（前身为 Elkhart Lake）的高端 15.6 英寸人机界面 (HMI)

  • Gb Ethernet, RS485, CAN, RS232, USB, Digital I/O
  • Integrated Gen11 UHD Graphics controller supporting 3 independent displays
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Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

  • 2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
  • Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
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