FINLAY

Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Alder Lake N):

·       Intel® Atom® x7213E, 2 Cores @1.7 GHz (3.2 GHz Turbo), 10W TDP, with TSN and TCC*

·       Intel® Atom® x7425E, 4 Cores @1.5 GHz (3.4 GHz Turbo), 12W TDP, with TSN and TCC*

·       Intel® Atom® x7211E, 2 Cores @1.0 GHz (3.2 GHz Turbo), 6W TDP, with TSN and TCC*

·       Intel® Core™ i3-N305, 8 Cores @1.8 GHz (3.8 GHz Turbo), 15W TDP

·       Intel® Processor N200, 4 Cores @1.0 GHz (3.7 GHz Turbo), 6W TDP

·       Intel® Processor N97, 4 Cores @2.0 GHz (3.6 GHz Turbo), 12W TDP

·       Intel® Processor N50, 2 Cores @1 GHz (3.4 GHz Turbo), 6W TDP

* Time Sensitive Network and Time Coordinate Computing

Up to 16GB LPDDR5-4800 soldered down memory with IBECC (in-band error correction code)

Integrated Intel® UHD Graphics driven by Intel® Xe architecture:

·       Intel® Atom® x7213E processors with 16 Execution Units

·       Intel® Atom® x7425E processors with 24 Execution Units

·       Intel® Atom® x7211E processors with 16 Execution Units

·       Intel® Core™ i3-N305 processors with 32 Execution Units

·       Intel® Processor N200 with 32 Execution Units

·       Intel® Processor N97 with 24 Execution Units

·       Intel® Processor N50 with 16 Execution Units

AVX256 & VNNI support for faster AI inference and media transcoding

Support with up to 3 independent 4K60 SDR displays

Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution

Up to 4096x2160 @60Hz

1x external S-ATA Gen3.2 channel

Optional eMMC 5.1 drive soldered on-board

2x NBase-T Ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports

Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane)

6x USB 2.0 host ports

2x USB 3.2 Gen2 ports

4x PCIe Gen3 lanes

Possible channel aggregations:

•  4 ports x1 lanes (4x1)
• 1 port x2 lanes + 2 ports x1 lane (1x2 + 2x1) or SERDES in place of fourth PCIe lane

HD Audio and Soundwire/i2S Audio interfaces

2x UARTs

2x HS-UARTs

Up to 14x GPIOs

SM bus

I2C bus

1x SPI interface for boot

1x General Purpose SPI or eSPI (factory alternatives)

Power management signals, watchdog

+5VDC and +3VDC for RTC

Microsoft® Windows 10

Linux Kernel LTS

0°C to +60°C (Commercial version) *

*Measured at any point of SECO standard heatspreader for this product, during

any and all times (including start-up). Actual temperature depends on the

application, enclosure, and/or environment. It is the customer’s responsibility to implement an application-specific cooling solution for the customer’s system that keeps the heat spreader temperature in the range indicated.