THEMIS

NXP i.MX 8 Family:
i.MX 8QuadMax: 2x ARM Cortex®-A72 + 4x ARM® Cortex®-A53 + 2x Cortex®-M4F
i.MX 8QuadPlus: 1x ARM Cortex®-A72 + 4x ARM® Cortex®-A53 + 2x Cortex®-M4F

Soldered down LPDDR4 memory, 64-bit interface, 1600MHz.
Base configuration 2GB, up-scalable to 4GB, 6GB, 8GB

2x Graphics accelerators Vivante GC7000 / XVSX or GC7000Lit / XVSX (QuadMax and QuadPlus)
1x embedded VPU, supporting H.265 (4K30) and H.264 (1080p60) decoding and H.264 (1080p30) encoding
Supports 3 independent video outputs (total combined resolution 4K)

OUTPUTS:
HDMI 2.0a Tx interface
Optional eDP 1.4 interface
Optional Single/Dual-Channel 18-/24- bit LVDS interface

INPUTS:
HDMI 2.0a Rx interface
2x 4-lanes MIPI-CSI Camera interfaces

HDMI: Up to UltraHD (4K)
LVDS, eDP: up to 1080p

eMMC 5.1 Drive soldered on-board, up to 64GB
1x S-ATA interface available on M.2 Socket 2 Key B Slot (interface shared with PCI-e x1)
microSD Card Slot
4MB QuadSPI Flash NAND (boot device only)

2x Gigabit Ethernet interfaces
Combo WiFi 802.11 a/b/g/n/ac + BT LE 4.2 module with ceramic SMT antennas on-board
M.2 Socket 2 Key B Slot for M.2 Modems
M.2 Socket1 Key E Slot for WiFi + BT external modules

1 x USB 3.0 Host port on Type-A socket
1x USB 2.0 OTG port on micro-AB socket
1x USB 2.0 Host port on external Type-A socket
1x USB 2.0 Host port on internal connector
2 x USB 2.0 ports available on M.2 Key B and Key E slots

I2S Audio Codec
HP + MIC interfaces, available on a single combo TRRS connector

1x UART TTL
1x RS-232 / UART TTL configurable
1x RS-485 / RS-422 / UART TTL configurable
3x CAN interfaces

4x Analog Inputs
6x GPIOs
SPI interface
I2C interface
Embedded additional RTC circuitry for lowest power consumption
SIM dedicated slot

+12VDC ± 10%

Wind River Linux
Yocto
Android

0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C  (Industrial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.