SOM-COMe-CT6-APL

Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

Two DDR3L SO-DIMM Slots supporting DDR3L-1866 non-ECC Memory, up to 8GB

Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
Three Independent displays supported
HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

Up to 2 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4b
eDP 1.3 or Single/Dual-Channel 18-/24- bit LVDS interface
optional VGA interface 

DP: Up to 4096 x 2160 @60HZ
eDP: Up to 3840 x 2160 @60Hz
HDMI: Up to 3840 x 2160 @30Hz
LVDS, VGA: Up to 1920 x 1200 @ 60Hz

Optional eMMC 5.0 drive soldered on-board
2 x external S-ATA Gen3 Channels
microSD Card Slot onboard

Optional Gigabit Ethernet interface
Intel® I210 or I211 GbE Controller (MAC + PHY) 

Up to 4 x USB 3.0 Host ports
8 x USB 2.0 Host port 

Up to 5 x PCI-e x 1 Gen2 lanes

HD Audio Interface

2 x UARTs

SPI, I2C, SM Bus, Thermal Management, FAN management
LPC bus
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4x GPI, 4 x GPO

+12VDC ± 10% and + 5VSB (optional)

Microsoft® Windows 10 Enterprise (64-bit)
Microsoft® Windows 10 IoT core
Wind River Linux (64 bit)
Yocto (64 bit)
Android (planning)

0°C  ÷ +60 °C (Commercial version)
-40°C ÷ +85°C (Industrial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.