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面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。

315 Products
[Picture] SBC-pITX-ASL

SBC-pITX-ASL

Pico-ITX SBC with the Intel® Atom™ Processor “Amston Lake” Industrial RE Series for the Edge

  • Up to 2x 2.5GbE, M.2 E-Key (WiFi+BT) , M.2 B-Key (WWAN)
  • Up to 2 independent displays (LVDS/eDP + HDMI) Integrated Intel® Graphics controller with up to 32 EU 4K60 HW decoding and encoding of HEVC (H.265), AVC (H.264), VP9, SCC, AV1 (decoding only)
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[Picture] SBC-pITX-TWL 1

SBC-pITX-TWL

Pico-ITX SBC with the Intel® Atom™ Processor "Twin Lake" Embedded PC Client N Series for the Edge

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[Picture] VIKTORIA_front

SBC-S984-MX6

SBC with NXP i.MX 6 Processor (VIKTORIA-S984)

  • 2D/3D dedicated graphics processors
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[Picture] SOM-COM-HPC-A-ARL- Pic 1

SOM-COM-HPC-A-ARL

COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E87)

  • Up to 2x NBase-T 2.5GbE; Up to 2x USB 20Gbps + 2x USB 10Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen4.
  • Up to 2x NBase-T 2.5GbE; Up to 2x USB 20Gbps + 2x USB 10Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen4.
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[Picture] SOM-COMe-BT6-ARL- Pic 1

SOM-COMe-BT6-ARL

COM Express Rel. 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E59)

  • 1x NBase-T 2.5GbE; 4x USB 10Gbps; 8x Hi- Speed USB; up to 20 PCI-e lanes Gen4.
  • Integrated Intel® Xe LPG+ graphic controller
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[Picture] SOM-COMe-BT6-RK3588- Pic 1

SOM-COMe-BT6-RK3588

COM Express® type 6 module based on Rockchip RK3588 SoC coupled to Axelera AI’s Metis AIPU

  • 1x NBase-T 1GbE; 2x USB Type-C with DP-Alt mode; 4x USB 5Gbps; 1x Hi-Speed USB; 4x PCI-e lanes
  • Arm Mali-G610 MC4 GPU, embedded VPU
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[Picture] SOM-COMe-CT6-R8000- Pic 1

SOM-COMe-CT6-R8000

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ Embedded 8000 Series. (F07)

  • AI ACCELERATOR: Embedded XDNA Neural Processing Unit (NPU)
  • Integrated AMD RDNA 3 graphics with up to 6 WGPs
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[Picture] SOM-COMe-CT6-TWL- Pic 3

SOM-COMe-CT6-TWL

COM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)

  • Integrated Intel® Gen12 UHD graphics controller with up to 32 EU
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[Picture] SOM-Myon-I-410E 2

SOM-Myon-I-410E

Micro CPU Computer on Module (CoM) with Snapdragon™ 410E (Formerly Myon I)

  • OpenGL ES 3.0, OpenCL / DirectX 12 graphics acceleration support for Windows 10 IoT Core
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[Picture] SOM-SMARC-Genio510- Pic 1

SOM-SMARC-Genio510

SMARC® Rel. 2.1.1 module with MediaTek Genio 510 Applications Processors. (E58)

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[Picture] SOM-SMARC-MX95- Pic 1

SOM-SMARC-MX95

SMARC® Rel. 2.1.1 module with NXP i.MX 95 Applications Processors. (E88)

  • 2D/3D GPU and NPU ML accelerator up to 2.0 TOP/s
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[Picture] SOM-SMARC-QCS5430- Pic 1

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor. (E81)

  • FHD+ Qualcomm® Adreno™ 642L
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[Picture] SOM-Trizeps-VII-MX6- Pic 1

SOM-Trizeps-VII-MX6

SODIMM-200 CPU Computer on Module (CoM) with NXP i.MX6 Applications Processors (Formerly Trizeps VII)

  • Vivante GC3500 2D accelerator + Vivante GC2000 3D accelerator
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[Picture] SOM-Trizeps-VIII-MX8M- Pic 2

SOM-Trizeps-VIII-MX8M

SODIMM-200 CPU Computer on Module (CoM) with NXP i.MX 8M Applications Processors (Formerly Trizeps VIII)

  • Integrated GPU with multi display support
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[Picture] SOM-Trizeps-VIII-MX8M-Mini- Pic 1

SOM-Trizeps-VIII-MX8M-Mini

SODIMM-200 CPU Computer on Module (CoM) with NXP i.MX 8M Mini Applications Processors (Trizeps VIII Mini)

  • GC320 2D accelerator + GCNanoUltra 3D accelerator
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