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面向最具创新性项目的一系列广泛的 SECO 产品:模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案,以及载板、入门套件和所有能有助完成您的项目的配件。
SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors. (E58)
SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor. (E81)
SMARC® Rel. 2.1 compliant module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08)
COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)
High end 10.1 inch HMI based on Intel Atom (formely Amston Lake)
High end 10.1 inch HMI based on NXP i.MX8M Plus
Entry level 10.1 inch HMI based on NXP i.MX95
High end 10.1 inch HMI based on Qualcomm® Dragonwing QCS6490
High end 15.6 inch HMI based on Intel Atom (formely Amston Lake)
High end 15.6 inch HMI based on NXP i.MX8M Plus
High end 15.6 inch HMI based on Qualcomm® Dragonwing QCS6490
High end 7.0 inch HMI based on NXP i.MX8M Plus
Modular fanless embedded PC with 13th Gen Intel® Core™ processors
10.1 inches HMI based on Raspberry Pi Compute Module 5
Pico-ITX SBC with the Intel® Atom™ Processor “Alder Lake N” Embedded PC Client N Series for the Edge