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SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor. (E81)

Product status

Development
Sampling
Production

Contact us for more information and quotes

CPU

Qualcomm® Dragonwing QCS6490

Graphics

FHD+ Qualcomm® Adreno™ 643

Connectivity

2x Gigabit Ethernet

Memory

LPDDR5-6400 up to 12GB

Product details

Technical Info

  • Description
    SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor. (E81)
  • Processor

    1x Arm® Cortex®-A78 @2.7 GHz, 3x Arm® Cortex®-A78 @2.4 GHz, and 4x Arm® Cortex®-A55 @1.8 GHz

  • Memory

    Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels

  • Graphics

    Qualcomm® Adreno™ 643L

  • Video Interfaces

    LVDS dual channel 18/24bit, eDP V1.4, MIPI DSI 4 lanes, Display Port through USB 3.1 Type C

    2x 4-Line MIPI CSI, with ISP support

  • Video Resolution

    Primary display: FHD+ @120 fps
    Secondary display: up to 4k Ultra HD @60Hz

  • Mass Storage

    eMMC 5.1 drive soldered on-board, up to 64GB (boot device)
    SD 4-bit interface (boot device) opt. UFS 2.x/3.1 flash

  • Networking

    2x Gigabit Ethernet interfaces
    Opt. Wi-Fi + BT5.0

  • USB

    1x USB 3.1, 1x USB 2.0 OTG, 1x USB 2.0 or 4x USB 2.0 (Hub option)

  • PCI-e

    PCIe lanes Gen3: 2 ports x1 lanes, 1 port x2 lanes (QPS615)

  • Audio

    2x I2S

  • Serial Ports

    2x UART (RX/TX/RTS/CTS), 2x UART (RX/TX)

  • Other Interfaces

    2C
    Ultra Low Power RTC
    2xPWM

  • Power Supply

    5V DC (+5V Standby opt)

  • Operating System

    Microsoft Windows 11 IoT Enterprise
    Yocto (Linux 64 Bit)
    Android

  • Operating Temperature

    0 ÷ +60°C (Commercial Range)
    -30 ÷ +85°C (Industrial Range)

     

    Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    82 x 50 mm

Part Number

  • PN-SOM-SMARC-QCS6490

    Part number description
    SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor. (E81)
    Contact us for more informations or quotes
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