SOM-SMARC-Genio700

2x Arm® Cortex®-A78 @ 2.2 GHz
6x Arm® Cortex®-A55 @ 2.0 GHz
AI Accelerator: Cadence Tensilica VP6 with Mediatek APU3.0
System Companion Chip: MDSP RV55
DSP: Candence Tensilica HiFi5
Image Signal Processor (ISP)

Soldered-down LPDDR4X-3733/LPDDR4-3200 memory, up to 8GB total

Mali-G57 MC3 GPU

LVDS Dual Channel or eDP (factory alternatives)
HDMI

DP

MIPI/eDP: up to 2560x1600p60
HDMI/DP: up to 4K60

eMMC 5.1 Drive soldered on-board, up to 64GB (boot device)
SDIO Interface

1x Gigabit Ethernet (RGMII)
1x 100Mbit Ethernet (USB)
Optional Wifi 802.11 a/b/g/n/ac 2x2 and BT 5.3 utilising onboard module with M2.1216 standard  form factor

1x USB3.1
1x USB2.0 Host/Slave
4x USB2.0 Host

2x I2S port

2x UART (4-wires)
2x UART (2-wires)

GPIOs
MIPI-CSI camera interface
General Purpose I2C Bus
PWM ports

+5VDC ± 5% and +3.3V_RTC

Linux Yocto Kirkstone
Android T (13)

0 ÷ +60°C (Commercial Range)*
-20 ÷ +85°C (Extended Commercial Range)*

-40 ÷ +85°C (Industrial Range)*

*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.