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[Picture] SOM-COMe-CT6-TWL- Pic 1

SOM-COMe-CT6-TWL

COM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)

Product status

Development
Sampling
Production

Contact us for more information and quotes

CPU

Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake)

Graphics

Integrated Intel® Gen12 UHD graphics controller with up to 32 EU

Memory

One SO-DIMM slot supporting DDR5-4800 IBECC memory, up to 16GB Security & Compliance by Design

Product details

Technical Info

  • Description
    COM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)
  • Processor

    Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Twin Lake):

    Intel® Core™ i3-N355 – 8 Cores @1.9 GHz (3.9 GHz Turbo), 15W TDP

    Intel® Processor N250 – 4 Cores @1.3 GHz (3.8 GHz Turbo), 6W TDP

    Intel® Processor N150 – 4 Cores @0.8 GHz (3.6 GHz Turbo), 6W TDP

  • Memory

    One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB

  • Graphics

    ntegrated Intel® Gen12 UHD graphics controller with up to 32 EU
    Support up to 3 independent displays

  • Video Interfaces

    2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C
    1x DDI Interface supporting DP / HDMI®
    1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives)

  • Video Resolution

    HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b
    DP 1.4, eDP 1.4: 4096x2304@60 Hz
    LVDS up to 1920x1200 @ 60Hz

  • Mass Storage

    Up to 2x S-ATA Gen3 channels
    Optional eMMC 5.1 drive soldered on-board

  • Networking

    1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN

  • USB

    Up to 2x USB 10Gbps
    Optional 3x USB 5Gbps
    8x Hi-Speed USB ports

  • PCI-e

    Up to 6x PCI-e Gen3 lanes

  • Audio

    HD Audio interface
    SoundWire Interface

  • Serial Ports

    2x UARTs

  • Other Interfaces

    SPI, 2x I2C, SM Bus, Thermal Management, FAN management
    Optional eSPI or LPC bus (factory alternatives)
    Optional TPM 1.2/2.0 on-board
    LID#/SLEEP#/PWRBTN#, watchdog
    4x GPI, 4x GPO
    Optional 2x CSI camera interfaces

  • Power Supply

    +12VDC ± 10%, +5VSB (optional), +3VRTC (optional)

  • Operating System

    Microsoft® Windows 10 IoT Enterprise 2019 LTSC
    Microsoft® Windows 10 IoT Enterprise 2021 LTSC
    Clea OS (Yocto)

  • Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    * Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)