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[Picture] SOM-COMe-CT6-R8000- Pic 1
[Picture] SOM-COMe-CT6-R8000- Pic 1

SOM-COMe-CT6-R8000

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ Embedded 8000 Series. (F07)

Product status

Development
Sampling
Production

Contact us for more information and quotes

CPU

APU AMD Ryzen™ 7 Pro and 5 Pro 8000 U and HS Series

Graphics

Integrated AMD RDNA 3 graphics with up to 6 WGPs

Connectivity

AI ACCELERATOR: Embedded XDNA Neural Processing Unit (NPU)

Memory

2x DDR5-5600 SODIMM Slots

Product details

Technical Info

  • Description
    COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ Embedded 8000 Series. (F07)
  • Processor

    AMD Ryzen™ Embedded 8000 Series Processors:

    AMD Ryzen™ 7 Pro 8845HS – 8 Cores / 16 Threads @ 3.8 GHz (5.1 GHz Turbo), 6 WGPs, TDP 45W (35–54W)

    AMD Ryzen™ 5 Pro 8645HS – 6 Cores / 12 Threads @ 4.3 GHz (5.0 GHz Turbo), 4 WGPs, TDP 45W (35–54W)

    AMD Ryzen™ 7 Pro 8840U – 8 Cores / 16 Threads @ 3.3 GHz (5.1 GHz Turbo), 6 WGPs, TDP 28W (15–30W)

    AMD Ryzen™ 5 Pro 8640U – 6 Cores / 12 Threads @ 3.5 GHz (4.9 GHz Turbo), 4 WGPs, TDP 28W (15–30W)

  • Memory

    2x DDR5-5600 SODIMM Slots

  • Graphics

    Integrated AMD RDNA 3 graphics with up to 6 WGPs (Work Group processors)

  • Video Interfaces

    Up to 4 independent displays.

    2x DDI interfaces supporting DP 2.0, HDMI 2.1, DP Alt Mode over Type-C

    1x DDI interface supporting DP 2.0 / HDMI 2.1

    eDP 1.5 or LVDS Single/Dual Channel interfaces (factory alternatives)

  • Video Resolution

    HDMI: Max 8K60

    DP: Max 7680x4320 @60Hz

    eDP, USB-C DP Alt: Max 3840x2160 @240Hz

    LVDS: Max 1920x1200

    Max resolution: 4 x 3840x2160 @60Hz

  • USB

    2x USB 40Gbps interfaces 2x USB 10Gbps interfaces (without USB Hub) 1x USB 10Gbps + 3x USB 5Gbps interfaces (with USB Hub) 8x Hi-Speed USB

  • PCI-e

    8x PCIe Gen 4 lanes (max 6 root ports) 1x8 or 2x4 PCI-e Graphics (PEG) Gen4 port

  • Audio

    HD Audio interface, Soundwire interface

  • Serial Ports

    2x 2-wires serial ports

  • Other Interfaces

    SPI, I²C, SM Bus, thermal management, FAN management

    LPC bus

    TPM 2.0 on-board (factory option)

    LID#/SLEEP#/PWRBTN#, watchdog

    4x GPI, 4x GPO

  • Power Supply

    Main Power: +12Vdc ± 10% Auxiliary: +5V_SBY, +3V_RTC

  • Operating System

    SECO Clea OS Microsoft® Windows 11 IoT Enterprise

  • Operating Temperature

    0°C ÷ +60°C (Commercial version)

  • Dimensions
    95 x 95 mm (Com Express® Compact Form factor, Type 6 pinout)