SOM-COMe-BT6-ARL
COM Express Rel. 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E59)
Product status
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CPU
Intel® Core™ Ultra Processors (Series 2 Family)
Graphics
Integrated Intel® Xe LPG+ graphic controller
Connectivity
1x NBase-T 2.5GbE; 4x USB 10Gbps; 8x Hi- Speed USB; up to 20 PCI-e lanes Gen4.
Memory
Two SODIMM slot supporting DDR5-5600 memory, IBECC support, up to 64GB
Product details
Technical Info
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Description
COM Express Rel. 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E59) -
Processor
Intel® Core™ Ultra Processors (H-SKUs):
- Intel® Core™ Ultra 9 processor 285H with vPRO, 6 P-Cores @2.5 GHz (turbo 5.4 GHz) + 8 E-Cores @1.9 GHz (turbo 4.5 GHz), 24M cache – 35/45/115W power
- Intel® Core™ Ultra 7 processor 265H, 6 P-Cores @1.2 GHz (turbo 5.4 GHz) + 8 E-Cores @0.9 GHz (turbo 4.5 GHz), 24M cache – 20/28/65W power
- Intel® Core™ Ultra 5 processor 235H with vPRO, 4 P-Cores @1.3 GHz (turbo 5.0 GHz) + 8 E-Cores @1.0 GHz (turbo 4.4 GHz), 18M cache – 20/28/65W power
Intel® Core™ Ultra Processors (U-SKUs):
- Intel® Core™ Ultra 7 processor 265U with vPRO, 2 P-Cores @1.8 GHz (turbo 5.3 GHz) + 8 E-Cores @1.5 GHz (turbo 4.2 GHz), 12M cache
- Intel® Core™ Ultra 5 processor 235U with vPRO, 2 P-Cores @1.6 GHz (turbo 4.9 GHz) + 8 E-Cores @1.0 GHz (turbo 4.1 GHz), 12M cache
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Memory
- Two DDR5 SO-DIMM slot supporting DDR5-6400 IBECC modules, up to 64GB
- (*) IBECC: In-Band Error-Correcting Code Memory
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Graphics
- Integrated Intel® Xe LPG+ graphics controller with up to 8 Xe cores (128 EU)
- Support up to 4 independent displays
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Video Interfaces
- 3x Digital Display Interfaces (DDIs), supporting DP, HDMI®
- 1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives)
- 2x MIPI CSI channels with single on-board connector (factory option)
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Video Resolution
- HDMI®: up to 8K60 according to HDMI® 2.1
- DP 2.1: up to 8K60Hz / 5K120Hz
- eDP 1.4b: up to 4K120Hz HDR
- Max resolution 4x4K60Hz
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Mass Storage
- Up to 2x S-ATA Gen3.2 channels (factory alternative to onboard NVMe + 1 PEG x4)
- Optional NVMe SSD (PCIE-e x4 interface) soldered onboard, up to 512GB
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Networking
1x NBase-T Ethernet interface with Intel® I226 GbE controller, supporting 2.5GbE
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USB
Up to 2x USB 4 Gen2 interfaces 4x USB 10Gbps interfaces 8x Hi-Speed USB interfaces
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PCI-e
1x PEG x8 Gen4 (with H series processors only) 1x PEG x4 Gen4 (factory alternative to 2x SATA) 8x PCI-e lanes Gen4 (allowed groupings x4, x2, x1)
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Audio
HD audio interface Soundwire interface
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Serial Ports
2x UARTs
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Other Interfaces
SPI, I2C, SM Bus, thermal management, FAN management eSPI or LPC bus (factory alternatives) TPM 2.0 on-board (factory option) LID#/SLEEP#/PWRBTN#, watchdog 4 x GPI, 4 x GPO
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Power Supply
Main: +8Vdc ÷ +20Vdc Auxiliary: +5VSBY, +3VRTC
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Operating System
Microsoft® Windows 10 IoT Enterprise 2019 LTSC Microsoft® Windows 10 IoT Enterprise 2021 LTSC Yocto Kirkstone
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Operating Temperature
0°C to +60°C (Commercial version)
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Dimensions
125 x 95 mm (COM Express® Basic Form factor, Type 6 Pinout)
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