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[Picture] SOM-COMe-BT6-PTL_perspective main
[Picture] SOM-COMe-BT6-PTL_perspective main

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Graphics

Integrated Intel® Graphics with up to 12 3rd Gen Xe Cores. Next-Gen Intel® IPU 7.5

Connectivity

1x NBase-T 2.5GbE; up to 2x USB4 40Gbps + 4x Superspeed 10Gbps; 8x Hi-Speed USB; Up to 20 PCI-e lanes

Memory

Two DDR5 SO-DIMM slots supporting DDR5-5600 up to 96GB

Product details

Technical Info

  • Description
    COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)
  • Processor

    COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

    • Intel® Core™ Ultra X9 Series 3 processors
    • Intel® Core™ Ultra X7 Series 3 processors
    • Intel® Core™ Ultra 9 Series 3 processors
    • Intel® Core™ Ultra 7 Series 3 processors
    • Intel® Core™ Ultra 5 Series 3 processors
  • Chipset

    COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

  • Memory

     

    2x DDR5-5600 SO-DIMM slots, up to 96GB

  • Graphics
    • Integrated Intel® Graphics with up to 12 3rd Gen Xe Cores
    • Support up to 4 independent displays
    • Next-Gen Imaging Processing Unit (IPU) 7.5 for 3x concurrent camera management
  • Video Interfaces
    • 2x Type-C interfaces supporting DP, DP Alt Mode over Type-C, HDMI, DP tunneled
    • 1x DDI interface supporting DP 2.1 2-lane/4-lane (factory option)
    • 1x eDP 1.5, max resolution 4K120Hz HDR or 1x LVDS Single/Dual Channel, max resolution 1920x1200 @ 60Hz (factory alternatives)
  • Video Resolution
    • Max resolution 4x 4K120Hz across four simultaneous displays
  • Mass Storage
    • Optional NVMe SSD soldered on-board, up to 1TB, PCI-e x4 interface
    • Optional, 2x SATA interface (commercial temp modules only)
  • Networking

    1x NBase-T Ethernet port via Intel® I226 Ethernet Controller, supporting 2.5GbE and TSN

  • USB

     

    Up to 2x USB4 40Gbps interfaces Up to 4x Superspeed USB 10Gbps interfaces 8x USB High-Speed ports

  • PCI-e
    • Up to 8 PCI-e Gen4 lanes
    • 1 PCI-e Graphics (PEG) x8 Gen5 port (depending on the processor)
    • Optional additional PEG x4 Gen4 port
  • Audio

    HD Audio interface SoundWire Interface

  • Serial Ports

     

    2x 2-wires UARTs

  • Other Interfaces
    • 2x MIPI-CSI 4-lane connectors, optional
    • SPI, 2x I2C, SMBus, thermal management, fan management
    • eSPI or LPC interface (factory alternatives)
    • Optional TPM 2.0 on-board
    • LID#/SLEEP#/PWRBTN#, watchdog
    • 4x GPI, 4x GPO
  • Power Supply

     

    Main: +12VDC ± 10% Auxiliary: +5VSB, +3VRTC

  • Operating System
    • Microsoft® Windows 11 IoT Enterprise 2021 LTSC
    • Clea OS
  • Operating Temperature
    • 0°C ÷ +60°C (Commercial version)
    • -40°C ÷ +85°C (Industrial version)
  • Dimensions
    125 x 95 mm (COM Express® Basic Form factor, Type 6 Pinout)

Part Number

  • SOM-COMe-BT6-PTL

    Part number description
    COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)
    Contact us for more informations or quotes
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