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[Picture] SBC-pITX-ASL
[Picture] SBC-pITX-ASL

SBC-pITX-ASL

Pico-ITX SBC with the Intel® Atom™ Processor “Amston Lake” Industrial RE Series for the Edge

Product status

Development
Sampling
Production
Data Sheet

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CPU

Intel® Atom™ Processor “Amston Lake” Industrial RE Series

Graphics

Up to 2 independent displays (LVDS/eDP + HDMI) Integrated Intel® Graphics controller with up to 32 EU 4K60 HW decoding and encoding of HEVC (H.265), AVC (H.264), VP9, SCC, AV1 (decoding only)

Connectivity

Up to 2x 2.5GbE, M.2 E-Key (WiFi+BT) , M.2 B-Key (WWAN)

Memory

LPDDR5-5200 Soldered Down Memory, Up to 16 GB, with IBECC support

Product details

Technical Info

  • Description
    Pico-ITX SBC with the Intel® Atom™ Processor “Amston Lake” Industrial RE Series for the Edge
  • Processor

    • Intel Atom™ x7211RE Dual Core @1GHz (3.2GHZ Turbo) 6W TDP w TSN and w TCC • Intel Atom™ x7213RE Dual Core @2GHz (3.4GHZ Turbo) 9W TDP w TSN and w TCC • Intel Atom™ x7433RE Quad Core @1.5GHz (3.4GHZ Turbo) 9W TDP w TSN and w TCC • Intel Atom™ x7835RE Eight Core @1.3GHz (3.6GHZ Turbo) 12W TDP w TSN and w TCC

  • Memory

    LPDDR5-5200 Soldered Down Memory, Up to 16 GB, with IBECC support

  • Graphics

    Integrated Intel® Gen 12 UHD Graphics driven by Intel® Xe architecture: • Intel® Atom® x7835E processors with 32 Execution Units • Intel® Atom® x7433RE processors with 32 Execution Units • Intel® Atom® x7213RE processors with 16 Execution Units • Intel® Atom® x7211RE processors with 16 Execution Units AVX256 & VNNI support for faster AI inference and media transcoding 3D API DirectX 12.1, OpenGL 4.6, Mesa 3D, Vulkan 1.2 4K60 HW decoding and encoding of HEVC (H.265), AVC (H.264), VP9, SCC, AV1 (decoding only)

  • Video Interfaces

    eDP 1.4b or Single/Dual Channel 18/24bit LVDS interface HDMI 1.4b interface

  • Video Resolution

    1x LVDS, Dual Channel 18/24-bit, up to 1920 x 1080 1 x HDMI 1.4b, up to 3840 x 2160 x 24bpp@20-30Hz eDP, Up to 4096 x 2304

  • Mass Storage

    Optional eMMC 5.1 drive soldered on-board, up to 128GB 1x SATA Gen3 7p M connector with + 4p M power connector 1x M.2 SATA SSD Slot (Socket 2 Key B size 2242/3042/3052/2260)**

  • Networking

    Up to 2x 2.5GbEthernet LAN ports available on 2x single RJ45 connectors M.2 WiFi+BT Connectivity Slot (Socket 1 Key E type 2230) M.2 WWAN Connectivity Slot (Socket 2 Key B size 2242/3042/3052/2260) coupled to on-board Nano-SIM slot**

  • USB

    2x SuperSpeed USB 10Gbps ports on Dual type-A socket 3x USB 2.0 ports on internal pin headers

  • Audio

    HD Audio Codec, Tempo Semicon 92HD68D3 S/PDIF Out and Mic In on internal pin header

  • Serial Ports

    2x Serial Ports (RS-232/RS-422/RS-485) on internal pin header

  • Other Interfaces

    2x I2C interfaces available on expansion internal header 8x GP I/Os interfaces available on expansion internal header 1x SPI interface available on expansion internal header Optional TPM 1.2/2.0 Module on-board FAN connector RST_BTN#, PWR_BTN# and activity LED signals on front panel pin header

  • Power Supply

    12VDC Cabled coin cell battery for RTC

  • Operating System

    Microsoft® Windows 11 IoT Enterprise LTSC Edgehog OS

  • Operating Temperature

    0°C - +60°C (Commercial version) -40°C - +85°C (Industrial version)

  • Dimensions
    100x72mm (3,93” x 2,83”)

Documentation