ALBION

NXP i.MX 8M Family, based on ARM® Cortex®-A53 MPCore + Cortex-M4 core platform:
i.MX 8M Quad - Quad core up to 1.5GHz
i.MX 8M QuadLite - Quad core up to 1.5 GHz per core
i.MX 8M Dual - Dual core up to 1.5 GHz per core 

Soldered down DDR3L memory, up to 2GB

Vivante GC7000Lite GPU, supporting OpenGL ES 1.1 / 2.0 / 3.0 / 3.1, Open CL 1.2 and Vulkan
Dedicated VPU (not for QuadLite), supporting 4Kp60 HEVC/H.265 main and main 10 decoder, 4Kp60 VP9 decoder, 4Kp30 AVC/H.264 decoder, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder
Dual Display support

embedded Display Port 1.4 connector (switched with HDMI)
Optional LVDS interface
Optional HDMI 1.4 / 2.0a interface (switched with eDP)
4-lane MIPI_CSI Camera interface

HDMI, eDP: up to 4096x2160
LVDS: up to 1920x1080 

Optional eMMC drive on-board, up to 16GB
microSD Card slot

Optional WiFi ac/a/b/g/n + BT 5 module with onboard U.FL antenna connectors
Gigabit Ethernet port
M.2 Socket 2 2260 / 3042 Key B slot for WWAN modules (modem)

USB Device on USB 2.0 micro-AB connector (interface shared with USB 3.0 port)
USB 3.0 Type-A connector (interface shared with USB 2.0 micro-AB)
USB 2.0 Dual Type-A connector
Optional USB 2.0 internal T/S connector (excludes one USB 2.0 Type-A interface)

I2S Audio Codec
Speaker + Microphone + Earphone interfaces on internal pin headers
Line Out + Mic In combo TRRS audio jack
Optional 10W for channel amplified Speaker connector

RS-232 Serial port connector
Debug UART on internal pin header
CAN Port

microSIM slot for M.2 modems
SPI interface
I2C Touch Screen dedicated connector
8 x GPI/Os connector
SPI Connector

+12VDC
Coin cell battery for RTC

Linux
Android

0°C ÷ +60°C (Commercial version)

-40°C ÷ +85°C (Industrial version, limited to -30°C ÷ +85°C when optional WiFi + BT module is mounted. Other limits depend on presence of SDIO bridge and / or Push buttons)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.