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73 Products

SOM-SMARC-TWL

SMARC® Rel. 2.1 compliant module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08)

  • Integrated Intel® Graphics with up to 32 Execution Units, supporting 3 independent displays
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SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

  • 1x NBase-T 2.5GbE; up to 2x USB4 40Gbps + 4x Superspeed 10Gbps; 8x Hi-Speed USB; Up to 20 PCI-e lanes
  • Integrated Intel® Graphics with up to 12 3rd Gen Xe Cores. Next-Gen Intel® IPU 7.5
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SBC-pITX-ADL-N

Pico-ITX SBC with the Intel® Atom™ Processor “Alder Lake N” Embedded PC Client N Series for the Edge

  • Up to 2x 2.5GbE, M.2 E-Key (WiFi+BT) , M.2 B-Key (WWAN)
  • Up to 2 independent displays (LVDS/eDP + HDMI) Integrated Intel® Graphics controller with up to 32 EU 4K60 HW decoding and encoding of HEVC (H.265), AVC (H.264), VP9, SCC, AV1 (decoding only)
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[Picture] SBC-pITX-ASL

SBC-pITX-ASL

Pico-ITX SBC with the Intel® Atom™ Processor “Amston Lake” Industrial RE Series for the Edge

  • Up to 2x 2.5GbE, M.2 E-Key (WiFi+BT) , M.2 B-Key (WWAN)
  • Up to 2 independent displays (LVDS/eDP + HDMI) Integrated Intel® Graphics controller with up to 32 EU 4K60 HW decoding and encoding of HEVC (H.265), AVC (H.264), VP9, SCC, AV1 (decoding only)
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[Picture] SBC-pITX-TWL 1

SBC-pITX-TWL

Pico-ITX SBC with the Intel® Atom™ Processor "Twin Lake" Embedded PC Client N Series for the Edge

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[Picture] SOM-COM-HPC-A-ARL- Pic 1

SOM-COM-HPC-A-ARL

COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E87)

  • Up to 2x NBase-T 2.5GbE; Up to 2x USB 20Gbps + 2x USB 10Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen4.
  • Up to 2x NBase-T 2.5GbE; Up to 2x USB 20Gbps + 2x USB 10Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen4.
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[Picture] SOM-COMe-BT6-ARL- Pic 1

SOM-COMe-BT6-ARL

COM Express Rel. 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E59)

  • 1x NBase-T 2.5GbE; 4x USB 10Gbps; 8x Hi- Speed USB; up to 20 PCI-e lanes Gen4.
  • Integrated Intel® Xe LPG+ graphic controller
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[Picture] SOM-COMe-BT6-RK3588- Pic 1

SOM-COMe-BT6-RK3588

COM Express® type 6 module based on Rockchip RK3588 SoC coupled to Axelera AI’s Metis AIPU

  • 1x NBase-T 1GbE; 2x USB Type-C with DP-Alt mode; 4x USB 5Gbps; 1x Hi-Speed USB; 4x PCI-e lanes
  • Arm Mali-G610 MC4 GPU, embedded VPU
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[Picture] SOM-COMe-CT6-R8000- Pic 1

SOM-COMe-CT6-R8000

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ Embedded 8000 Series. (F07)

  • AI ACCELERATOR: Embedded XDNA Neural Processing Unit (NPU)
  • Integrated AMD RDNA 3 graphics with up to 6 WGPs
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[Picture] SOM-COMe-CT6-TWL- Pic 3

SOM-COMe-CT6-TWL

COM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)

  • Integrated Intel® Gen12 UHD graphics controller with up to 32 EU
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[Picture] SOM-SMARC-Genio510- Pic 1

SOM-SMARC-Genio510

SMARC® Rel. 2.1.1 module with MediaTek Genio 510 Applications Processors. (E58)

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[Picture] SOM-SMARC-MX95- Pic 1

SOM-SMARC-MX95

SMARC® Rel. 2.1.1 module with NXP i.MX 95 Applications Processors. (E88)

  • 2D/3D GPU and NPU ML accelerator up to 2.0 TOP/s
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[Picture] SOM-SMARC-QCS5430- Pic 1

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor. (E81)

  • FHD+ Qualcomm® Adreno™ 642L
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