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COM Express Standard

适用于高端设计和高端市场
高图形处理
功能丰富
用于高性能项目
基本格式（125x95 毫米）和小型格式（95x95 毫米）
嵌入式模块计算机方法的优点
在硬件设计方面的投资只是购买载板
综合标准
可扩展且面向未来的解决方案
长期可用性
Arm 和 x86 兼容性强
多供应商解决方案
高度可配置性
創新和可升级的解决方案
缩短上市时间
描述

COM Express® 标准允许以快速或经济的方式定制项目。SECO 模块提供 COM Express® 类型 6 和 类型 7 ， 它们采用两种格式：基本格式的尺寸为 125 x 95 毫米，适用于高能量灵敏度的装置;小型格式的尺寸为 95x95 毫米，是高性能和小尺寸之间是一个很好的折中方案 。

COM Express® 界面

22 Products

SOM-COMe-CT6-EHL

COM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake). (E37)

  • 1x NBase-T 2.5GbE; 4x USB3.2 Gen 1; 8x USB 2.0; 6x PCI-e lanes Gen3
  • Integrated Intel® Gen11 UHD graphics controller with up to 32 EU
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[Picture] SOM-COMe-BT6-MTL_front sito

SOM-COMe-BT6-MTL

COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U). (E59)

  • 1x NBase-T 2.5GbE; 4x USB 10Gbps; 8x Hi-Speed USB; up to 20 PCI-e lanes Gen4
  • Integrated Intel® Xe LPG graphic controller with up to 128 EU
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SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

  • 1x NBase-T 2.5GbE; up to 2x USB4 40Gbps + 4x Superspeed 10Gbps; 8x Hi-Speed USB; Up to 20 PCI-e lanes
  • Integrated Intel® Graphics with up to 12 3rd Gen Xe Cores. Next-Gen Intel® IPU 7.5
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[Picture] SOM-COMe-BT6-ARL- Pic 1

SOM-COMe-BT6-ARL

COM Express Rel. 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E59)

  • 1x NBase-T 2.5GbE; 4x USB 10Gbps; 8x Hi- Speed USB; up to 20 PCI-e lanes Gen4.
  • Integrated Intel® Xe LPG+ graphic controller
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[Picture] SOM-COMe-BT6-RK3588- Pic 1

SOM-COMe-BT6-RK3588

COM Express® type 6 module based on Rockchip RK3588 SoC coupled to Axelera AI’s Metis AIPU

  • 1x NBase-T 1GbE; 2x USB Type-C with DP-Alt mode; 4x USB 5Gbps; 1x Hi-Speed USB; 4x PCI-e lanes
  • Arm Mali-G610 MC4 GPU, embedded VPU
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[Picture] SOM-COMe-CT6-R8000- Pic 1

SOM-COMe-CT6-R8000

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ Embedded 8000 Series. (F07)

  • AI ACCELERATOR: Embedded XDNA Neural Processing Unit (NPU)
  • Integrated AMD RDNA 3 graphics with up to 6 WGPs
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[Picture] SOM-COMe-CT6-TWL- Pic 3

SOM-COMe-CT6-TWL

COM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)

  • Integrated Intel® Gen12 UHD graphics controller with up to 32 EU
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