THEBE

AMD EPYC™ Embedded 3000 family of SoCs:

• AMD EPYC™ Embedded 3451, Sixteen Core Dual Thread @ 2.14GHz (3.0 Boost), 32MB L3 shared Cache, TDP 80-100W
• AMD EPYC™ Embedded 3351, Twelve Core Dual Thread @ 1.9GHz (3.0 Boost), 32MB L3 shared Cache, TDP 60-80W
• AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W
• AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W
• AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W
• AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W
• AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade 

Up to 4x DDR4 SO-DIMM Slots supporting DDR4-2666 Memory (both ECC and not-ECC supported), up to 128GB

2x S-ATA Gen3 Channels

• 1x Gigabit Ethernet LAN port with NC-SI (Network Controller Sideband Interface) functionality, managed by an Intel® I210 Gigabit Ethernet Controller
• 4x 10Gigabit Ethernet interfaces (10GBASE-KR), directly managed by the EPYC™ SoCs

4 x USB 3.1 Host ports (SS + USB 2.0 interfaces)

24x PCI-e Gen3 lanes

2x legacy UARTs, 16C550 compatible

SPI, SM Bus, LPC bus

+12VDC ± 10% and + 5VSB (optional)

Microsoft® Windows 10 
Microsoft® Windows Server 2016
Linux OS 64-bit

0°C  ÷ +60 °C (Commercial version)
-40°÷+85°C (Industrial Range, when available)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.